Brazil NCM · 4-digit heading
NCM 74.10 – Copper foil, thickness 0.15 mm or less
About NCM heading 74.10
Copper foil (whether or not printed or backed with paper, paperboard, plastics or similar backing materials) of a thickness (excluding any backing) not exceeding 0.15mm
Heading 74.10 of Brazil's NCM has 10 eight-digit codes. Official Portuguese description: Folhas e tiras, delgadas, de cobre (mesmo impressas ou com suporte de papel, cartão, plástico ou semelhantes), de espessura não superior a 0,15 mm (excluindo o suporte).
The first four digits, 7410, identify this heading within chapter 74. Its six-digit subheadings follow the international HS system; the final two digits distinguish Mercosur's NCM classifications. Select a code below to read its English translation, official Portuguese text and full classification path.
For product coverage and classification context, read the HS heading 74.10 guide.
NCM codes in heading 74.10 10
- 7410.1 Not backed: Sem suporte:
- 7410.11 Copper; foil, not backed, of a thickness not exceeding 0.15mm, of refined copperDe cobre refinado (afinado) HS code
- 7410.11.1 Foil of a thickness not exceeding 0.07 mm and of a purity of 99.85 % or more, by weight Folha de espessura inferior ou igual a 0,07 mm e com pureza igual ou superior a 99,85 %, em peso
- 7410.11.12 Pure copper foil up to 0.04 mm, low resistivityDe espessura inferior ou igual a 0,04 mm e uma resistividade elétrica inferior ou igual a 0,017241 ohm.mm²/m
- 7410.11.13 Other pure copper foil up to 0.04 mmOutras, de espessura inferior ou igual a 0,04 mm
- 7410.11.19 Pure copper foil, over 0.04 mm up to 0.07 mmOutras
- 7410.11.90 Other unbacked refined copper foilOutras
- 7410.12.00 Unbacked copper alloy foilDe ligas de cobre
- 7410.2 Backed: Com suporte:
- 7410.21 Copper; foil, backed with paper, paperboard, plastics or similar backing material, of a thickness (excluding any backing) not exceeding 0.15mm, of refined copperDe cobre refinado (afinado) HS code
- 7410.21.10 Copper foil on epoxy-glass for printed circuitsCom suporte isolante de resina epóxida e fibra de vidro, do tipo utilizado para circuitos impressos
- 7410.21.20 Copper foil on polyester or polyimide backingCom espessura superior a 0,012 mm, sobre suporte de poliéster ou poliimida e com espessura total, incluindo o suporte, inferior ou igual a 0,195 mm
- 7410.21.30 Copper foil on phenolic paper for printed circuitsCom suporte isolante de resina fenólica e papel, do tipo utilizado para circuitos impressos
- 7410.21.90 Other backed refined copper foilOutras
- 7410.22.00 Backed copper alloy foilDe ligas de cobre
Source: Siscomex Classif NCM table, updated Oct 2026 (Resolução Gecex nº 926/2026). The Portuguese text is the official one; the English is our translation.