About HS Code 848640
This category encompasses machinery used in the crucial backend processes of semiconductor manufacturing, including the production and repair of masks and reticles, the assembly (packaging) of semiconductor devices and integrated circuits, and the automated handling of these sensitive items within a fabrication plant. These machines transform fabricated wafers into finished, packaged chips and ensure the efficient, damage-free movement of materials. Trade in these goods is vital for the global electronics supply chain, with specialized equipment manufacturers supplying to assembly and test houses worldwide. Importers and exporters are typically countries with significant roles in chip packaging, testing, and overall semiconductor logistics, ensuring the final quality and usability of electronic components.
Products Under This Code
Die bonders, Wire bonders, Flip-chip bonders, Automatic test equipment (ATE), Wafer probers, Mask writers, Reticle inspection systems, Automated material handling systems (AMHS), Cleanroom robots
Real World Examples
KLA-Tencor e-beam mask writers, Advantest V93000 ATE, ASM Pacific Technology (ASMPT) wire bonders, Disco DAD3000 dicing saws, Teradyne UltraFLEX
Common Misclassification
Often confused with 848620 (front-end fabrication) or general industrial robots (8479) if the specific application to semiconductor assembly, mask production, or handling isn't clearly recognized. The 'lifting, handling, loading or unloading' aspect is key.
Products Classified Under 8486.40
Industry
This code belongs to the Electronics & Electrical Equipment industry.
Trade Overview
Key importing and exporting nations include Malaysia, Singapore, USA, Japan, and China, reflecting major assembly and test hubs.
Frequently Asked Questions
What is HS code 848640?
HS code 848640 covers: Machines and apparatus of a kind used solely or principally for the manufacture or repair of masks and reticles, assembling semiconductor devices or electronic integrated circuits, or for lifting, handling, loading or unloading items of heading 8486. This category encompasses machinery used in the crucial backend processes of semiconductor manufacturing, including the production and repair of masks and reticles, the assembly (packaging) of semiconductor devices and integrated circuits, and the automated handling of these sensitive items within a fabrication plant. These machines transform fabricated wafers into finished, packaged chips and ensure the efficient, damage-free movement of materials. Trade in these goods is vital for the global electronics supply chain, with specialized equipment manufacturers supplying to assembly and test houses worldwide. Importers and exporters are typically countries with significant roles in chip packaging, testing, and overall semiconductor logistics, ensuring the final quality and usability of electronic components.
What products fall under HS code 848640?
Die bonders, Wire bonders, Flip-chip bonders, Automatic test equipment (ATE), Wafer probers, Mask writers, Reticle inspection systems, Automated material handling systems (AMHS), Cleanroom robots
What are common misclassifications for HS code 848640?
Often confused with 848620 (front-end fabrication) or general industrial robots (8479) if the specific application to semiconductor assembly, mask production, or handling isn't clearly recognized. The 'lifting, handling, loading or unloading' aspect is key.
How is HS code 848640 structured?
HS code 848640 is a 6-digit subheading under the Harmonized System. The first 2 digits (84) identify the chapter, digits 3-4 (86) identify the heading, and digits 5-6 (40) specify the subheading. This code is standardized globally by the World Customs Organization.