HS Code for Semiconductor assembly machine
Semiconductor assembly machines are classified under HS code 8486.40. Heading 8486 was specifically created to consolidate machines and apparatus used solely or principally for the manufacture of semiconductor boules, wafers, devices, electronic integrated circuits, or flat panel displays. Sub-heading 8486.40 focuses on the assembly stage of the semiconductor manufacturing process. This includes the physical mounting of the die onto a lead frame or substrate and the subsequent electrical connection and encapsulation. The classification is driven by Note 11 to Chapter 84, which mandates that machines meeting the description of heading 8486 must be classified there and nowhere else in the Nomenclature, overriding more general headings for mechanical appliances or electrical machinery.
Products Included
- Die bonders for attaching semiconductor chips to substrates
- Wire bonders for creating electrical connections between chips and pins
- Encapsulation equipment for sealing semiconductor devices in plastic or ceramic
- Wafer dicing saws and laser scribing machines
- Flip-chip assembly equipment
Common Misclassification
Before the creation of heading 8486, these machines were often classified under 8479 (machinery having individual functions) or 8515 (soldering and welding machines). Even today, some components are misclassified under 8515.11 or 8515.19 because of the soldering nature of wire bonding. However, because these machines are used "solely or principally" for semiconductor assembly, 8486.40 takes legal precedence. Testing equipment for semiconductors is also sometimes confused with assembly machines but should be classified under 9030.
FAQ
What is the HS code for semiconductor assembly machine?
The specific HS code for machines used in the assembly of semiconductor devices is 8486.40.
Does 8486.40 include machines for making printed circuit boards?
No, machines for the manufacture of printed circuit boards (PCBs) are generally classified under 8486.30 or other specific headings, as 8486.40 is focused on the assembly of the semiconductor devices themselves.
Industry
Frequently Asked Questions
What is the HS code for Semiconductor assembly machine?
The HS code for Semiconductor assembly machine is 848640 (Machines and apparatus of a kind used solely or principally for the manufacture or repair of masks and reticles, assembling semiconductor devices or electronic integrated circuits, or for lifting, handling, loading or unloading items of heading 8486).
How do I classify Semiconductor assembly machine for customs?
Semiconductor assembly machine is classified under HS code 848640 — Machines and apparatus of a kind used solely or principally for the manufacture or repair of masks and reticles, assembling semiconductor devices or electronic integrated circuits, or for lifting, handling, loading or unloading items of heading 8486. This is a 6-digit subheading level code.
Is the HS code for Semiconductor assembly machine the same in all countries?
The base HS code 848640 for Semiconductor assembly machine is internationally standardized for the first 6 digits across 200+ countries. Individual countries may add additional digits for national tariff lines and specific classifications.