HS Code for Semiconductor wafer machine

Machines used for the manufacture of semiconductor boules or wafers are classified under HS code 848610. This heading was introduced to the Harmonized System to provide a single location for the complex machinery used in the semiconductor industry. Heading 8486 covers machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, integrated circuits, or flat panel displays. Subheading 848610 specifically targets the beginning of the production chain: the creation of the semiconductor boule (the raw ingot) and the processing of that boule into thin wafers. The classification is based on the "solely or principally" rule, meaning the machine must be designed specifically for this industry. These machines perform high-precision tasks such as crystal pulling, slicing, grinding, and polishing, which are unique to the preparation of semiconductor substrates.

Products Included

• Czochralski crystal pullers
• Wafer slicing saws (diamond wire or inner diameter)
• Wafer edge grinding machines
• Chemical mechanical polishing (CMP) equipment for wafers
• Wafer lapping machines

Common Misclassification

These machines are frequently misclassified under HS code 8464, which covers machine tools for working stone, ceramics, concrete, or similar mineral materials. While a wafer saw might look like a stone saw, Note 9 to Chapter 84 explicitly directs semiconductor manufacturing equipment to heading 8486. Another error is using HS code 8479, which is for general-purpose machinery. Because 8486 is more specific to the semiconductor industry, it takes precedence over 8479 according to GRI 3(a).

FAQ

What is the HS code for wafer machines?

The HS code for machines used to manufacture semiconductor boules or wafers is 848610.

Does this include machines that make the actual chips?

No, machines that manufacture the actual semiconductor devices (like lithography or etching tools) are classified under HS code 848620.