About HS Code 854290
This HS code covers the specialized parts and components used in the manufacturing and assembly of electronic integrated circuits (ICs). Unlike the finished ICs themselves, this category focuses on the intermediate materials and sub-components that are essential before an IC is fully encapsulated and functional. This includes items like unmounted semiconductor dies (chips before packaging), lead frames specifically for ICs, substrates, and certain packaging materials. Countries with significant semiconductor assembly, test, and packaging (ATP) operations, as well as advanced fabrication plants, are the primary importers, notably Taiwan, South Korea, China, and Singapore. Exporters are typically nations specializing in high-precision materials science, advanced chemical processing, and specialized manufacturing equipment, such as Japan, Germany, and the USA. The trade in these parts is highly technical, requiring stringent quality control and purity, as they directly impact the performance and reliability of the final integrated circuit.
Products Under This Code
Unmounted semiconductor dies (bare chips), IC lead frames, Ceramic substrates for ICs, Organic substrates for ICs, Bonding wires for ICs, Encapsulation resins for ICs, Wafer-level packaging components
Real World Examples
Amkor lead frames, ASE substrates, Sumitomo Bakelite molding compounds, K&S bonding wire, Shin-Etsu photoresists, Disco dicing blades, Applied Materials deposition materials
Common Misclassification
Often confused with parts for discrete semiconductor devices (854190) or even raw semiconductor wafers (which might fall under 381800 or 250610 if unprocessed), but 854290 is specific to parts *for* integrated circuits.
Industry
This code belongs to the Electronics & Electrical Equipment industry.
Trade Overview
Taiwan, South Korea, and China are major importers; Japan, USA, and Germany are key exporters.
Frequently Asked Questions
What is HS code 854290?
HS code 854290 covers: Parts of electronic integrated circuits. This HS code covers the specialized parts and components used in the manufacturing and assembly of electronic integrated circuits (ICs). Unlike the finished ICs themselves, this category focuses on the intermediate materials and sub-components that are essential before an IC is fully encapsulated and functional. This includes items like unmounted semiconductor dies (chips before packaging), lead frames specifically for ICs, substrates, and certain packaging materials. Countries with significant semiconductor assembly, test, and packaging (ATP) operations, as well as advanced fabrication plants, are the primary importers, notably Taiwan, South Korea, China, and Singapore. Exporters are typically nations specializing in high-precision materials science, advanced chemical processing, and specialized manufacturing equipment, such as Japan, Germany, and the USA. The trade in these parts is highly technical, requiring stringent quality control and purity, as they directly impact the performance and reliability of the final integrated circuit.
What products fall under HS code 854290?
Unmounted semiconductor dies (bare chips), IC lead frames, Ceramic substrates for ICs, Organic substrates for ICs, Bonding wires for ICs, Encapsulation resins for ICs, Wafer-level packaging components
What are common misclassifications for HS code 854290?
Often confused with parts for discrete semiconductor devices (854190) or even raw semiconductor wafers (which might fall under 381800 or 250610 if unprocessed), but 854290 is specific to parts *for* integrated circuits.
How is HS code 854290 structured?
HS code 854290 is a 6-digit subheading under the Harmonized System. The first 2 digits (85) identify the chapter, digits 3-4 (42) identify the heading, and digits 5-6 (90) specify the subheading. This code is standardized globally by the World Customs Organization.